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Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM).
Assembly line. An assembly line, often called progressive assembly, is a manufacturing process where the unfinished product moves in a direct line from workstation to workstation, with parts added in sequence until the final product is completed. By mechanically moving parts to workstations and transferring the unfinished product from one ...
Computer-aided manufacturing (CAM) also known as computer-aided modeling or computer-aided machining[1][2][3] is the use of software to control machine tools in the manufacturing of work pieces. [4][5][6][7][8] This is not the only definition for CAM, but it is the most common. [4] It may also refer to the use of a computer to assist in all ...
During this time, a typical SMT assembly line employed two different types of pick-and-place (P&P) machines arranged in sequence. The unpopulated board was fed into a rapid placement machine. These machines, sometimes called chip shooters, place mainly low-precision, simple package components such as resistors and capacitors.
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
Computer-aided process planning (CAPP) is the use of computer technology to aid in the process planning of a part or product, in manufacturing. CAPP is the link between CAD and CAM in that it provides for the planning of the process to be used in producing a designed part.
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