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In power engineering, a single-line diagram ( SLD ), also sometimes called one-line diagram, is a simplest symbolic representation of an electric power system. [ 1][ 2] A single line in the diagram typically corresponds to more than one physical conductor: in a direct current system the line includes the supply and return paths, in a three ...
TO-3. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.
Wire bonding. The interconnections in a power package are made using thick (250 to 400 μm), wedge-bonded, aluminium wires. Inside a wire-bonded BGA package. This package has an Nvidia GeForce 256 GPU. Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during ...
A quad flat package ( QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. [ 1] Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common.
Flip chip. Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
A wiring diagram is a simplified conventional pictorial representation of an electrical circuit. It shows the components of the circuit as simplified shapes, and the power and signal connections between the devices. A wiring diagram usually gives information about the relative position and arrangement of devices and terminals on the devices, to ...
Eight-contact DIP switch with 0.3" wide 16-pin (DIP16N) footprint. In microelectronics, a dual in-line package ( DIP or DIL) [1] is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.
The earliest version of PowerPoint (1987 for Macintosh) could be used to print black and white pages to be photocopied onto sheets of transparent film for projection from overhead projectors, and to print speaker's notes and audience handouts; the next version (1988 for Macintosh, 1990 for Windows) was extended to also produce color 35mm slides ...